| Sponsor |
|
Particle-Free Plasma Oxide Reduction
Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more.
Surfx Technologies
|
|
| Press Release |
October 2, 2024 - Click the title to read the full press release.
MRSI Mycronic proudly introduces the next generation high precision MRSI-175Ag epoxy dispenser. This latest innovation is a significant improvement in MRSI’s epoxy dispensing ...
MRSI Mycronic
February 18, 2026
VIEWPOINT 2026: Irving Wang, Director of Marketing, MRSI Mycronic
|
September 8, 2025
MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025
MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions at the 26th China International Optoelectronic Exposition (CIOE) from September ...
|
June 17, 2025
MRSI Systems Files Patent Infringement Lawsuit Against Suzhou LieQi in China
MRSI Systems, LLC filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People's Court for infringement ...
|
February 4, 2025
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing ...
|
January 21, 2025
VIEWPOINT 2025: Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI, Mycronic
|
October 2, 2024
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
MRSI Mycronic proudly introduces the next generation high precision MRSI-175Ag epoxy dispenser. This latest innovation is a significant improvement in MRSI’s epoxy dispensing ...
|
September 9, 2024
MRSI Mycronic to Showcase Advanced Assembly Solutions at CIOE 2024
MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition ...
|
September 11, 2023
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems has launched the MRSI-705HF high force die bonder, a new variant of the proven ...
|
August 23, 2023
MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023
MRSI, a part of Mycronic Group, will exhibit our family of die bonders and present at the 24th China International Optoelectronic Exposition (CIOE) September 6-8 ...
|
August 14, 2023
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
MRSI Systems, a part of Mycronic Group, has been awarded the Silver Honoree for the Laser Focus World Innovators Award 2023 in the Manufacturing Equipment for Photonic ...
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
|
|
|
