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Hermetic Package Seam Seal with HDHS® Technology
Brings a new level of precision and automation for hi-rel microelectronic package encapsulation, increasing seal yields to 99.99% and lowering operation costs for Aerospace, Military, Microwave, Photonics and MEMS.
MicroCircuit Laboratories, LLC
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| Press Release |
September 9, 2024 - Click the title to read the full press release.
MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition ...
MRSI Mycronic
February 18, 2026
VIEWPOINT 2026: Irving Wang, Director of Marketing, MRSI Mycronic
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September 8, 2025
MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025
MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions at the 26th China International Optoelectronic Exposition (CIOE) from September ...
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June 17, 2025
MRSI Systems Files Patent Infringement Lawsuit Against Suzhou LieQi in China
MRSI Systems, LLC filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People's Court for infringement ...
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February 4, 2025
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing ...
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January 21, 2025
VIEWPOINT 2025: Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI, Mycronic
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October 2, 2024
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
MRSI Mycronic proudly introduces the next generation high precision MRSI-175Ag epoxy dispenser. This latest innovation is a significant improvement in MRSI’s epoxy dispensing ...
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September 9, 2024
MRSI Mycronic to Showcase Advanced Assembly Solutions at CIOE 2024
MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition ...
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September 11, 2023
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems has launched the MRSI-705HF high force die bonder, a new variant of the proven ...
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August 23, 2023
MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023
MRSI, a part of Mycronic Group, will exhibit our family of die bonders and present at the 24th China International Optoelectronic Exposition (CIOE) September 6-8 ...
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August 14, 2023
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
MRSI Systems, a part of Mycronic Group, has been awarded the Silver Honoree for the Laser Focus World Innovators Award 2023 in the Manufacturing Equipment for Photonic ...
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| Sponsor |
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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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