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Sponsor
Nordson-ASYMTEK

Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions
Advanced-Component-Labs
Press Release
July 25, 2023  -  Click the title to read the full press release.

Applied Materials and Fraunhofer IPMS launch European Semiconductor - Metrology Technology Hub



Applied Materials, Inc. and the Fraunhofer Institute for Photonic Microsystems IPMS announced a landmark collaboration ...

Fraunhofer IPMS
March 25, 2026
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials
CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in ...
March 18, 2026
A new level of thin-film characterization is within reach
The Fraunhofer Institute for Photonic Microsystems IPMS has launched the publicly funded SMut project, in collaboration with its partners Credoxys and SweepMe! to develop ...
February 25, 2026
Fraunhofer IPMS collaborates with Korean TSN Lab
The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab on new real-time solutions as part of the "Global Cooperative R&D" funding ...
February 2, 2026
Cutting-edge research for the European AI market
On October, the 1st 2025, the NeAIxt research project was launched, bringing together over 55 partners from across the EU. The project's long-term goal is to strengthen ...
November 5, 2025
From Semiconductor Technology to Quantum Computing: Light Modulation Solutions for Japan's Key Industries
The Fraunhofer Institute for Photonic Microsystems IPMS in Germany is a leading research institute in the area of spatial light modulators (SLMs), a technology that ...
July 21, 2025
Fraunhofer IPMS and DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
The Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor ...
June 26, 2025
Design tools for improved hardware security of RFETs
Chip design is a crucial step in the development of application-specific microelectronic components and must take functionality, reliability and security aspects into ...
June 9, 2025
Project GENESIS minimizes ecological footprint in Europe's semiconductor industry
A pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch ...
June 4, 2025
Successful Development of Innovative and Versatile Evaluation Platform for Spatial Light Modulators
For the first time, Fraunhofer IPMS presents its advanced, high-performance evaluation kits for spatial light modulators, which now feature tilting or piston mirrors as actuator ...
May 28, 2025
Pioneering energy-efficient AI with innovative ferroelectric technology
As artificial intelligence (AI) becomes increasingly integrated into sectors such as healthcare, autonomous vehicles and smart cities, traditional computing architectures face  ...
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Sponsor
Amkor-Technology

LAB Flip Chip Reflow Process Robustness Prediction
Predicting laser-assisted bonding (LAB) parameters and ideal solder temperature range for a black box substrate. Read more.
Amkor Technology, Inc.
Brewer-Science