Sponsor

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology

Press Release

March 20, 2023 - Click the title to read the full press release.

nScrypt & Sciperio 3D Manufacture Conformal Heaters With Variable Resistance Traces

A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...

nScrypt

March 20, 2023
nScrypt & Sciperio 3D Manufacture Conformal Heaters With Variable Resistance Traces
A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...

January 31, 2019
VIEWPOINT 2019: Xudong Chen, VP of Marketing and Sales, nScrypt, Inc.
"Companies constantly look at potential technical solutions that might disrupt electronic packaging. The consumer is becoming more demanding and wants more functions, in smaller packages and battery life extended by factors of 2 or even 10. As enabling technology begins to emerge, the companies are recognizing that it is ...

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science