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Improve BGA Rework Success with Proven Reballing Techniques
Successful BGA reballing depends on precision, process control, and attention to detail. Circuit Technology Center utlizies proven methods and techniques.
Circuit Technology Center

Press Release

March 20, 2023 - Click the title to read the full press release.

nScrypt & Sciperio 3D Manufacture Conformal Heaters With Variable Resistance Traces

A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...

nScrypt

March 20, 2023
nScrypt & Sciperio 3D Manufacture Conformal Heaters With Variable Resistance Traces
A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...

January 31, 2019
VIEWPOINT 2019: Xudong Chen, VP of Marketing and Sales, nScrypt, Inc.
"Companies constantly look at potential technical solutions that might disrupt electronic packaging. The consumer is becoming more demanding and wants more functions, in smaller packages and battery life extended by factors of 2 or even 10. As enabling technology begins to emerge, the companies are recognizing that it is ...

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Rapid Package Seam Seal Changeover
The Robotic Cover Sealer (RCS) enables rapid assembly changeover on < 5 minutes from a 3 x 3 mm to 50 x 70 mm package. Package tooling may be adjustable or tool less.
MicroCircuit Laboratories, LLC