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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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| Press Release |
March 20, 2023 - Click the title to read the full press release.
A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...
nScrypt
July 9, 2026
Sciperio Awarded U.S. Patent for Breakthrough High-Viscosity Material Dispensing Technology
Sciperio, Inc. announced the issuance of U.S. Patent No. 12,654,396 B2, titled "Pump for Additive Manufacturing." The patented technology, which forms the foundation ...
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March 20, 2023
nScrypt & Sciperio 3D Manufacture Conformal Heaters With Variable Resistance Traces
A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...
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January 31, 2019
VIEWPOINT 2019: Xudong Chen, VP of Marketing and Sales, nScrypt, Inc.
"Companies constantly look at potential technical solutions that might disrupt electronic packaging. The consumer is becoming more demanding and wants more functions, in smaller packages and battery life extended by factors of 2 or even 10. As enabling technology begins to emerge, the companies are recognizing that it is ...
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