Sponsor

Die-Module Attach for High Power Devices
High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding.
AI Technology, Inc.

Press Release

March 20, 2023 - Click the title to read the full press release.

nScrypt & Sciperio 3D Manufacture Conformal Heaters With Variable Resistance Traces

A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...

nScrypt

March 20, 2023
nScrypt & Sciperio 3D Manufacture Conformal Heaters With Variable Resistance Traces
A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...

January 31, 2019
VIEWPOINT 2019: Xudong Chen, VP of Marketing and Sales, nScrypt, Inc.
"Companies constantly look at potential technical solutions that might disrupt electronic packaging. The consumer is becoming more demanding and wants more functions, in smaller packages and battery life extended by factors of 2 or even 10. As enabling technology begins to emerge, the companies are recognizing that it is ...

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Sponsor

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group