Sponsor

How LAPLACE® Laser Assisted Bonding Saves Energy
LAPLACE® enables fast, localized laser bonding with minimal heat exposure—cutting energy use while ensuring precision for sensitive advanced packaging processes. Watch Demo.
PacTech

Press Release

March 20, 2023 - Click the title to read the full press release.

nScrypt & Sciperio 3D Manufacture Conformal Heaters With Variable Resistance Traces

A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...

nScrypt

March 20, 2023
nScrypt & Sciperio 3D Manufacture Conformal Heaters With Variable Resistance Traces
A recent study conducted by a team in nScrypt's research arm, Sciperio, demonstrated a significant improvement in the performance of conformal ...

January 31, 2019
VIEWPOINT 2019: Xudong Chen, VP of Marketing and Sales, nScrypt, Inc.
"Companies constantly look at potential technical solutions that might disrupt electronic packaging. The consumer is becoming more demanding and wants more functions, in smaller packages and battery life extended by factors of 2 or even 10. As enabling technology begins to emerge, the companies are recognizing that it is ...

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
Advanced Component Labs, Inc.