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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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| Viewpoint |
January 31, 2019
VIEWPOINT 2019: Xudong Chen, VP of Marketing and Sales, nScrypt, Inc.
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Xudong Chen, VP of Marketing and Sales, nScrypt, Inc.
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"Companies constantly look at potential technical solutions that might disrupt electronic packaging. The consumer is becoming more demanding and wants more functions, in smaller packages and battery life extended by factors of 2 or even 10. As enabling technology begins to emerge, the companies are recognizing that it is important to not let that move past them.
Companies are being very strategic and doing their due diligence for potential enablers. Enablers come in all shapes and sizes but one thing is very clear, shape and size matter; they want smaller packages, much smaller and they want them in diverse shapes and they want it to happen quickly.
We are all about precision and material choice for microelectronic packaging. We are focusing our efforts on precision dispensing adhesives, solders, conductive epoxies, conductors and dielectrics in the range that pushes the envelope of standard dispensing and doing so with exceptional precision.
Direct printing or dispensing from CAD files on the nScrypt platforms for electronic packaging allows flexibility, wide range of material choice, features in the 10's of microns range and a path to change quickly from product to product without tool changes, by simply changing from one CAD file to another."
Xudong Chen, VP of Marketing and Sales
nScrypt, Inc.
http://www.nscrypt.com
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