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Are You Getting Component Tinning Right?
Component lead tinning involves more than dipping parts in solder. Learn about robotic hot solder dip processing, gold removal, solder thickness control, and process considerations.
Circuit Technology Center
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| Industry Paper |
Optimizing cycle times in the semiconductor industry with Openair-Plasma
Plasma surface treatment has many uses in semiconductor manufacturing. This process can be used for surface treatment in wire bonding and die bonding, thermal compress bonding, and pre-molding, read more.
Plasmatreat GmbH
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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