| Industry Paper |
A Hybrid PLP Technology Based On A 650 X 650 mm Platform
A novel panel-level packaging technology, Hybrid PLP, reduces costs by enabling the processing of multiple wafers on a large 650mm x 650mm panel. It enhances reliability and flexibility for advanced chip applications.
Amkor Technology, Inc.
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ECTC Call for Papers Due October 5
ECTC invites abstracts for its 77th conference. The leading packaging event will showcase 2.5D/3D integration, chiplets, hybrid bonding, panel-level packaging, photonics, glass substrates and advanced materials.
ECTC
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