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Are You Getting Component Tinning Right?
Component lead tinning involves more than dipping parts in solder. Learn about robotic hot solder dip processing, gold removal, solder thickness control, and process considerations.
Circuit Technology Center
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IR Layer Release Technology for 3D Packaging and Logic Scaling
Revolutionary layer transfer approach that enables nanometer-precision release of ultra-thin bonded, deposited or grown layers from silicon carrier substrates using an IR laser and specially formulated inorganic release materials.
EV Group
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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