|
Sponsor
|
|
Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
|
|
| Industry Paper |
IR Layer Release Technology for 3D Packaging and Logic Scaling
Revolutionary layer transfer approach that enables nanometer-precision release of ultra-thin bonded, deposited or grown layers from silicon carrier substrates using an IR laser and specially formulated inorganic release materials.
EV Group
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
A Lifespan of Reliability
Nordson Electronics Solutions makes reliable electronics an everyday reality. Selective soldering, dispensing, coating, and plasma solutions.
Nordson Electronics Solutions
|
|
|
