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Gold Mitigation: What Engineers Need to Know
When gold-plated component surfaces enter the solder joint, reliability can be at risk. This technical paper examines gold removal, robotic hot solder dip processing, testing, and process control.
Circuit Technology Center
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| Industry Paper |
Package and Die Attach Material Comparisons for High Power GaN Devices
Explore the vital role of packaging GaN devices! This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn.
StratEdge Corporation
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S-Connect™: Advanced Bridge Die Solution
Introducing Amkor's new S-Connect™, S-SWIFT™ with an embedded silicon bridge, delivering improved power integrity and signal performance.
Amkor Technology
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