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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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| Industry Paper |
How to Wire Pull?
Learn how to perform an optimal pull test on wires or ribbons. This extensive guide also covers loop height measurement, vector pull, and SMD gull-wing leads pull.
XYZTEC
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A Lifespan of Reliability
Nordson Electronics Solutions makes reliable electronics an everyday reality. Selective soldering, dispensing, coating, and plasma solutions.
Nordson Electronics Solutions
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