Semiconductor Packaging News Index

News Index

Page 4 of 2285

22848 news listings.

May 3, 2024

SUMMARY

Hybrid Bonding: The Time has Come
The semiconductor industry faces escalating demand for finer interconnection technology. Direct copper bonding emerges as a solution, promising sub-micrometer pitch ...
3DInCites

May 3, 2024

SUMMARY

Qualcomm gives solid outlook in sign of smartphone recovery
Qualcomm Inc projects a robust sales period, signaling a handset demand surge after a two-year dip. Forecasting $8.8-9.6 billion revenue ...
Taipei Times

May 3, 2024

SUMMARY

Fueling U.S. Semiconductor Competitiveness: Open Markets Abroad
US semiconductor industry pushes for open markets abroad to maintain competitiveness. Advocates emphasize the need for fair trade policies and ...
Semiconductor Industry Association

May 3, 2024

SUMMARY

Powerchip launches new 12-inch fab
Powerchip Semiconductor Manufacturing Corp launched a new 12-inch fab, leveraging CoWoS packaging technology for AI devices. Chairman Frank Huang announced ...
Taipei Times

May 3, 2024

SUMMARY

Imec.xpand launches €300M fund for semiconductor and nanotech startups
Imec.xpand launches a €300 million fund in collaboration with imec to propel semiconductor and nanotechnology breakthroughs. Targeting globally disruptive startups, ...
Tech EU

May 3, 2024

SUMMARY

Fundamental Issues In Computer Vision Still Unresolved
Challenges persist in advancing computer vision, with fundamental issues like data efficiency and robustness unresolved. Researchers grapple with complexities, seeking ...
Semiconductor Engineering

May 3, 2024

SUMMARY

SK hynix to mass-produce industry-leading 12H HBM for AI chip leadership: CEO
SK hynix CEO Kwak Noh-jung unveils plans to mass-produce cutting-edge 12-layer high bandwidth memory (HBM) chips in Q3, reinforcing the ...
Yonhap News Agency

May 3, 2024

SUMMARY

Specialty IC foundry VIS gains shifted orders from China
VIS, a Taiwan-based semiconductor firm, surpasses expectations in Q1 2024 despite Chinese market rivalry. The 8-inch foundry adapts to pricing ...
Digitimes

May 3, 2024

SUMMARY

Microsoft to open new data center in Thailand as it doubles down on AI and Southeast Asia
Microsoft expands its Southeast Asia footprint with a new data center in Thailand, enhancing cloud services accessibility and bolstering regional ...
CNBC

May 3, 2024

SUMMARY

Nvidia supplier SK Hynix says HBM chips almost sold out for 2025
SK Hynix reports sold-out HBM chips for 2024, nearly depleted for 2025, amid surging demand for AI services. Plans to ...
Reuters

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address