Semiconductor Packaging News Index

News Index

Page 3 of 2435

24344 news listings.

Dec 5, 2024

SUMMARY

Arm Aims to Democratize Chiplets
Arm's Total Design initiative, with 29 partners, drives chiplet innovation. Teaming up with Samsung and Rebellions, it launched a 64-core ...
EE Times

Dec 5, 2024

SUMMARY

China to curb exports of chip components to US
China announced export restrictions on key semiconductor materials like gallium, germanium, and graphite, citing national security. The move follows new ...
Taipei Times

Dec 5, 2024

SUMMARY

Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
Luc Van den hove from Imec highlighted advanced packaging's vital role in semiconductor innovation at SEMICON Europa 2024. Industry experts ...
3DInCites

Dec 5, 2024

SUMMARY

Silicon Rivalry: U.S. Restrictions vs. China's Capital Market Reforms
The U.S.-China tech rivalry intensifies with contrasting strategies. The U.S. tightens investment rules to curb China's advancements in AI and ...
EE Times

Dec 5, 2024

SUMMARY

Apple says it uses Amazon's custom AI chips
Apple revealed its reliance on Amazon Web Services' AI chips, including Inferentia and Graviton, at AWS Reinvent, citing 40% efficiency ...
CNBC

Dec 5, 2024

SUMMARY

Microchip pauses CHIPS Act application amid inventory woes
Microchip Technology Inc paused its bid for $162 million in CHIPS Act subsidies, citing excess factory capacity and financial concerns. ...
Taipei Times

Dec 5, 2024

SUMMARY

Intel Corp approaches new candidates for CEO
Intel is evaluating external candidates, including industry veteran Tan Lip-bu, for CEO after ousting Pat Gelsinger. The board seeks fresh ...
Taipei Times

Dec 5, 2024

SUMMARY

Dutch chipmaker NXP, TSMC affiliate plan to expand US$7.8 billion Singapore venture
NXP Semiconductors and Taiwan's Vanguard International Semiconductor Corp broke ground on a Singapore chip plant, highlighting plans for a $7.8 ...
South China Morning Post

Dec 5, 2024

SUMMARY

The Evolution of HBM
High-bandwidth memory (HBM) has evolved from boosting 2.5D package capacity to becoming a high-performance computing cornerstone, even replacing SRAM in ...
Semiconductor Engineering

Dec 5, 2024

SUMMARY

NAND Flash Targets 1,000 Layers
The chip industry is driving toward 3D NAND flash with up to 800 layers, addressing memory demands while battling reliability ...
Semiconductor Engineering

Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address