Semiconductor Packaging News Index

News Index

Page 4 of 2282

22818 news listings.

May 1, 2024

SUMMARY

Apple needs China more than China needs Apple
Apple's descent to fifth place in China's cellphone market is marked by local brands outselling it. Chinese tech's rise & ...
Asia Times

Apr 30, 2024

SUMMARY

Multi-Die Design Pushes Complexity To The Max
Cutting-edge multi-die design in semiconductor industry pushes complexity limits, integrating diverse functionalities onto a single chip package. This trend enhances ...
Semiconductor Engineering

Apr 30, 2024

SUMMARY

TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
TSMC's A16 process sets new standards in semiconductor technology, advancing the tech leadership game. With smaller transistors and enhanced performance, ...
EE Times

Apr 30, 2024

SUMMARY

IBM, Government of Canada, Government of Quebec Sign Agreements to Strengthen Canada's Semiconductor Industry
IBM, in collaboration with the Government of Canada and the Government of Quebec, signs agreements to bolster Canada's semiconductor industry, ...
IBM

Apr 30, 2024

SUMMARY

Intel has a wafer-level assembly problem, and it's hurting Core Ultra sales
Intel faces a hurdle with wafer-level assembly, impacting Core Ultra sales. The issue disrupts production, leading to supply constraints and ...
TechSpot

Apr 30, 2024

SUMMARY

Huawei's Pura 70 smartphone contains new 7-nm HiSilicon chip made by top Chinese foundry SMIC
Huawei's Pura 70 smartphone debuts with a cutting-edge 7nm chip crafted by Chinese foundry SMIC, marking a milestone in domestic ...
South China Morning Post

Apr 30, 2024

SUMMARY

Microchip Drives Chip Innovation With TSMC, AI Advancements
Microchip collaborates with TSMC to propel chip innovation, leveraging advanced AI technologies. This partnership aims to enhance efficiency and performance, ...
EE Times

Apr 30, 2024

SUMMARY

TSMC lays out roadmap for massive, kilowatt-class chip packages and terabit optical links
TSMC unveils groundbreaking roadmap for kilowatt-class chip production, aiming to revolutionize high-performance computing. The plan promises energy efficiency and performance ...
TechSpot

Apr 30, 2024

SUMMARY

Taiwan semiconductor firm KYEC to exit mainland China amid geopolitical tensions, changes in cross-strait chip supply chain
Taiwan's King Yuan Electronics Co (KYEC), a major semiconductor testing and packaging services firm, sells its Suzhou subsidiary amid geopolitical ...
South China Morning Post

Apr 30, 2024

SUMMARY

Overlay Optimization In Advanced IC Substrates
Advanced IC substrates benefit from overlay optimization, crucial for precise alignment in multi-layer manufacturing. Enhanced overlay techniques, like machine learning-driven ...
Semiconductor Engineering

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