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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
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Reduce the Risk of Tin Whiskers
Tin whiskers can create shorts and threaten electronic system reliability. Explore the causes of tin whisker growth and learn how component tinning and robotic hot solder dip processing can help mitigate the risk.
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March 11, 2026

David Heller, CEO, Heller Industries

Will you be launching new products or services in 2026?
At Heller Industries, innovation drives our position as the leading thermal solution provider for SMT and semiconductor manufacturing. In 2026, we are excited to launch many new features including a revolutionary flux management system delivering unprecedented efficiency with low maintenance, batch reflow for wafer and panel bumping for maximized thruput, and new software for improved productivity.

Is your company using Artificial Intelligence?
Heller Industries powers the future of AI by enabling reliable production of next-generation chips and hardware. We don’t just support innovation; we accelerate it. From boosting software team efficiency with AI to preserving and sharing expertise through an intelligent online library, we embrace the same AI revolution we help drive.

Have tariffs affected your business plans?
Heller Industries delivers wherever our customers are through a Glocal (Global and Local) strategy -- global production sites with local service team. Our resilient supply chain keeps our equipment moving with minimal tariff impact. Customers choose Heller Industries for quality, innovation, and world-class support, and proudly join us as we expand our global footprint. Our diversified manufacturing base allows our customers flexibility to order systems from multiple factory locations globally.

What is the outlook for your business in 2026?
With the rapid global expansion of AI infrastructure and high-spec automotive technology, Heller Industries is ready for another near record year in 2026. We're accelerating innovation to meet surging demand globally, especially in the U.S., Mexico, and Europe, driven by the fast adoption of advanced technologies.

Additionally, we continue to expand our footprint globally with new demo centers in Germany and Mexico along with additional personnel to support our ever-expanding customer base.

David Heller
CEO, Heller Industries
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Henkel AG & Co.
Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
Automated Solder Ball Placement for WLCSP Flip Chip