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Uyemura
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
1000N 1000KG
Sponsor
Circuit Technology Center
Reduce the Risk of Tin Whiskers
Tin whiskers can create shorts and threaten electronic system reliability. Explore the causes of tin whisker growth and learn how component tinning and robotic hot solder dip processing can help mitigate the risk.
Circuit Technology Center
Viewpoint
March 9, 2026

Rich DePoto, Business Development Manager, Uyemura

Uyemura has invested ambitiously in advanced chemical technologies. As such, we can find ourselves with extraordinary solutions . . . in search of problems. When adaptation advances slowly, this approach can appear inefficient – at least temporarily.

Today's electrical design needs are clearly outpacing what's broadly available.

In our estimation, this represents a unique opportunity, where adoption of new technology solutions is now in "pull" mode. The prudent adoption of new technology is essential for companies to thrive, and for brands to increase in value.

As a supplier of advanced technology, I regard our responsibilities as fourfold. First, a thorough understanding of process requirements, including extensive resources for reliability testing. Second, extensive field support, including co-located engineering for newly adopted or installed technologies. Next, comprehensive analytical and failure analysis capability in place and fully functional. And fourth, Six Sigma statistical measurement capability and controls.

The core of our 5-year plan is a commitment to being the Partners of Choice for forward-thinking design engineers – particularly those that understand the merits of early adoption, and prioritize getting and keeping competitive advantage.

Rich DePoto
Business Development Manager, Uyemura
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Sponsor
Henkel AG & Co.
Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
Automated Solder Ball Placement for WLCSP Flip Chip