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DL Technology
Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
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StratEdge Corporation
Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
Viewpoint
March 9, 2026

Rich DePoto, Business Development Manager, Uyemura

Uyemura has invested ambitiously in advanced chemical technologies. As such, we can find ourselves with extraordinary solutions . . . in search of problems. When adaptation advances slowly, this approach can appear inefficient – at least temporarily.

Today's electrical design needs are clearly outpacing what's broadly available.

In our estimation, this represents a unique opportunity, where adoption of new technology solutions is now in "pull" mode. The prudent adoption of new technology is essential for companies to thrive, and for brands to increase in value.

As a supplier of advanced technology, I regard our responsibilities as fourfold. First, a thorough understanding of process requirements, including extensive resources for reliability testing. Second, extensive field support, including co-located engineering for newly adopted or installed technologies. Next, comprehensive analytical and failure analysis capability in place and fully functional. And fourth, Six Sigma statistical measurement capability and controls.

The core of our 5-year plan is a commitment to being the Partners of Choice for forward-thinking design engineers – particularly those that understand the merits of early adoption, and prioritize getting and keeping competitive advantage.

Rich DePoto
Business Development Manager, Uyemura
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Brewer Science
Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Openair Plasma for Semiconductor Manufacturing