Paul Crothers, Vice President of Semiconductor Segment, TransPak

Expanding Testing Capabilities and In-Transit Visibility for Semiconductor Customers

The world's semiconductor supply chains will continue to shift toward higher-value, larger, and more complex equipment in 2026 to power AI and advanced nodes. To keep pace with the industry's needs, packaging and logistics solutions will need to become even more predictive and data-driven. At TransPak, we're already expanding our testing and validation capabilities to meet customers' needs.

One area of focus in 2026 is expanded test lab services that allow customers to validate packaging performance before equipment enters transit. These new capabilities include environmental testing chambers that simulate extreme conditions, ranging from high temperatures and humidity to cold, dry environments, along with drop, vibration, compression, and shock testing designed to test large, heavy components.

New testing systems designed to support loads up to 15,000 pounds will allow customers to better simulate real-world transport conditions and work to reduce risk, prevent damage, and avoid costly delays.

In parallel, TransPak's new Field Data Analytics team will leverage high-fidelity technology to monitor live shipments for shock, vibration, tilt, temperature, and other critical hazards. The team will transform this data into actionable insights, delivering clear reports that define packaging design criteria and support transport simulation testing.

Together, these capabilities signal a broader move toward intelligence-driven packaging and logistics as the semiconductor industry scales globally.