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DL Technology
Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
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StratEdge Corporation
Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
Viewpoint
February 20, 2026

Abdul Lateef, CEO, Plasma-Therm LLC

As we enter 2026, Plasma-Therm remains committed to enabling advanced semiconductor manufacturing companies and research institutions to achieve breakthroughs in efficiency, precision, and innovation.

Our systems and software continue to play a critical role in supporting our customer partners, helping advance next-generation devices and applications, including in healthcare and emerging electronics.

Looking ahead, 2026 will be defined by collaboration and applied innovation. By working closely with leading universities, research programs, and industry initiatives, we aim to accelerate technology development and transform it into practical solutions for manufacturers.

Upcoming enhancements to our Cortex® software and equipment portfolio will deliver greater control, repeatability, and process efficiency - empowering customers to push the boundaries of semiconductor manufacturing and advanced packaging.

We also see 2026 as an opportunity to strengthen thought leadership, sharing insights, best practices, and industry guidance to help partners navigate rapidly evolving technology landscapes. With a talented team, strong partnerships, and a commitment to innovation, Plasma-Therm is ready to help the industry meet complex challenges, advance research, and shape the future of semiconductor and advanced manufacturing technologies.

Abdul Lateef
CEO, Plasma-Therm LLC
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Brewer Science
Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Openair Plasma for Semiconductor Manufacturing