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Uyemura
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
1000N 1000KG
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Circuit Technology Center
Reduce the Risk of Tin Whiskers
Tin whiskers can create shorts and threaten electronic system reliability. Explore the causes of tin whisker growth and learn how component tinning and robotic hot solder dip processing can help mitigate the risk.
Circuit Technology Center
Viewpoint
February 20, 2026

Abdul Lateef, CEO, Plasma-Therm LLC

As we enter 2026, Plasma-Therm remains committed to enabling advanced semiconductor manufacturing companies and research institutions to achieve breakthroughs in efficiency, precision, and innovation.

Our systems and software continue to play a critical role in supporting our customer partners, helping advance next-generation devices and applications, including in healthcare and emerging electronics.

Looking ahead, 2026 will be defined by collaboration and applied innovation. By working closely with leading universities, research programs, and industry initiatives, we aim to accelerate technology development and transform it into practical solutions for manufacturers.

Upcoming enhancements to our Cortex® software and equipment portfolio will deliver greater control, repeatability, and process efficiency - empowering customers to push the boundaries of semiconductor manufacturing and advanced packaging.

We also see 2026 as an opportunity to strengthen thought leadership, sharing insights, best practices, and industry guidance to help partners navigate rapidly evolving technology landscapes. With a talented team, strong partnerships, and a commitment to innovation, Plasma-Therm is ready to help the industry meet complex challenges, advance research, and shape the future of semiconductor and advanced manufacturing technologies.

Abdul Lateef
CEO, Plasma-Therm LLC
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Henkel AG & Co.
Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
Automated Solder Ball Placement for WLCSP Flip Chip