Casey Krawiec, VP of Global Sales, StratEdge Corporation

As a company specializing in the design, production, and assembly of high-frequency, high-power semiconductor packages for defense and aerospace applications, StratEdge experienced another strong year. Since 1985, we have been a leader in delivering high-performance packaging solutions for RF, microwave, and millimeter-wave devices.

All StratEdge packages are designed to be rugged and reliable, capable of withstanding harsh operating environments while maintaining excellent high-frequency performance. Over the past year, demand grew significantly for our high-reliability packages supporting gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC) technologies.

Building on this momentum, we expect sales to continue rising in 2026. One key area of focus is our gold-plated tabs for die-on-tab chip-on-board (COB) applications. In a die-on-tab configuration, a high-power semiconductor device is mounted directly onto a metallic tab, also known as a heat spreader or submount, which helps transfer heat efficiently to the next-level assembly, typically a printed circuit board (PCB).

For system designers operating in Ku- through E-band frequencies, the benefits of COB approaches can outweigh the advantages of packaging the device first. When properly installed, StratEdge's gold plated tabs can improve device reliability, increase power output and efficiency, and extend overall device life.

While StratEdge remains a strong proponent of fully packaged solutions, our long-standing commitment to innovation and reliability enables us to support evolving system architectures. As we move into the coming year, we are well positioned to meet new opportunities while continuing to deliver trusted performance to our customers.