Konrad Roessler, CEO, Heidelberg Instruments Mikrotechnik GmbH

Maskless Lithography at the Forefront: Enabling Growth Across Emerging Markets

In 2025, Heidelberg Instruments, a supplier of direct-write lithography tools for R&D and industry, saw an increased demand from semiconductor packaging industry. The advantages of "maskless" are well-known: adaptability to distorted substrates, resolution below 2 microns, sharp patterns on warped substrates and topography.

Based on the Heidelberg Instruments MLA 300 platform, we introduced in 2025 a new model with higher speed at a resolution of 3 microns. First systems have been shipped and installed.

For 2026, the goal is to develop a system with same high throughput and 1.5 micron resolution. Market launch is scheduled for 2027. Besides very good pattern quality and speed, cost-of-ownership and affordability are important as the tool is targeting mid to low volume production and prototyping.

Currently, Heidelberg Instruments is joining R&D collaborations for advanced packaging on glass and polymer substrates. The challenges of various applications provide the knowledge and technology to build better exposure tools.

Concerning the markets, we observe a clear shift from R&D to industry. There is less public funding but more investment by industry. Tariffs or trade barriers are a threat but fortunately not yet serious. With AI strongly growing and emerging fields like quantum technology, we are optimistic about growth this year.