semiconductor
packaging news
Sponsor
DL Technology
Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
Packaging Solutions #2
Sponsor
StratEdge Corporation
Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
Viewpoint
February 9, 2026

Minoru Inoue, Branch Manager of Semiconductor Materials Sales Branch, Sekisui Chemical

In 2025, aside from the slowdown in demand for power semiconductors due to the EV recession, the market conditions were generally the same as or better than the previous year. The temporary market stagnation caused by the advance demand in anticipation of tariff increases largely subsided in the first half of the period, and the market conditions returned to normal in the second half.

Towards 2026, the development direction of "decentralized AI" in AI server is becoming apparent, leading to a broad increase in demand from high-end to mid-range. Our related products are also expected to continue to see steady growth.

Next year, we will introduce multiple new build-up film products to the market. In AI servers, the development direction is shifting from solely focusing on speed to balancing power consumption and cost. For substrate boards, there is an increasing demand for materials that we specialize in, such as low Df and low Dk for electrical properties, as well as materials needed to achieve complex package structures like chiplets and component-encapsulating substrates, etc. To meet these expectations, we are preparing numerous development items.

We also use AI as a tool. SEKISUI group has officially launched its proprietary Material Informatics (MI) application, "RASIN" (R&D Accelerator for SEKISUI's innovative Notions), to accelerate and enhance materials development. RASIN is a no-code app, eliminating the need for programming skills, which allows researchers across the group to efficiently utilize MI technology to discover material properties and insights.

SEKISUI group will continue to strengthen its efforts in the MI field to consistently provide innovative materials required by the industry.

Minoru Inoue
Branch Manager of Semiconductor Materials Sales Branch, Sekisui Chemical
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Brewer Science
Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Openair Plasma for Semiconductor Manufacturing