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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
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February 4, 2026

Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE

Not Just More of the Same: Innovation at All Levels

Talking about semiconductors in 2025 inevitably means discussing artificial intelligence (AI)—and the geopolitical challenges shaping the industry. However, we are seeing technological progress across many aspects of the industry.

Single-digit nanometer logic technology is a fascinating segment of the semiconductor industry, pushing structures down into the single-atom scale toward fundamental physical limits. But scaling alone is not the only innovation required to keep the "brain" of the AI infrastructure busy.

The larger systems that generate data through MEMS devices, transport that data through high-speed optical links, and deliver the power required to move and process these massive data volumes are also critically important.

In 2026, many of these applications will gain even more momentum. Emerging technologies will move from R&D to production, while established technologies will become more cost-efficient.

VON ARDENNE's equipment portfolio will be used to drive innovation across materials, processes, and form factors in advanced packaging and co-packaged optical and electrical chips.

With its newly established cleanroom and decades of experience, VON ARDENNE is well-positioned in 2026 to develop new materials and help customers ramp up their production faster.

Guido Ueberreiter
VP Semiconductor Strategy, VON ARDENNE
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Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
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