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DL Technology
Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
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StratEdge Corporation
Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
Viewpoint
February 2, 2026

Greg DeLarge, President, Plasma Etch, Inc.

As we conclude another strong year, we are proud of the progress and innovation enjoyed by our organization and our customers.

The performance and reliability of our plasma systems continue to be demonstrated across a wide range of applications from the circuit board industry to aerospace. We remain dedicated to customer success by helping clients maximize the effectiveness of their plasma cleaning systems through training, service, and support.

Looking toward 2026, we are eager to expand our impact in the bonding and PCB etching markets, not to mention some of the exciting advances our AI customer are making in high performance hardware.

Trade Shows
We are excited to participate in several industry events throughout the year and welcome the opportunity to connect in person. You can find us exhibiting at SEMICON West, October 13–15 in San Francisco, and CAMX, September 21-24 in Atlanta, GA. At both events, we will showcase our popular Plasma Wand® entry-level atmospheric plasma system.

We appreciate the continued trust of our customers and partners and look forward to another productive and successful year!

Greg DeLarge
President, Plasma Etch, Inc.
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Brewer Science
Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Openair Plasma for Semiconductor Manufacturing