Tobias Königer, Head of Product Management Semiconductor Packaging, DELO Industrial Adhesives

Advanced Materials for Scalable and Energy-Efficient Photonic Integration

Silicon photonics, or photonic integrated circuits (PICs), are emerging as a key enabler for next generation data communication and computing. By routing and processing signals with photons on a silicon platform, PICs drastically increase bandwidth while minimizing latency and power dissipation. These are critical advantages, as AI workloads and cloud infrastructures scale exponentially.

At the core of PIC performance lies advanced packaging and assembly. Sub micron alignment tolerances between optical components demand materials with exceptional curing properties, optical transparency, and thermal reliability. This is where adhesive technology plays a pivotal role.

Drawing on deep expertise in optical materials and wafer level processing, DELO develops photonic grade adhesives optimized for coupling efficiency. Aiming for the innovative technological approach of co-packaged optics, this requires CTE matching, dimensional stability and low outgassing performance. Our materials ensure reliable bonding interfaces that maintain optical alignment and signal integrity over temperature and lifetime stress.

In close cooperation with industry and research partners, DELO will continue to drive material innovations in 2026 and beyond that enable scalable, energy-efficient photonic integration and form the technological foundation for the data infrastructures of the future.