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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
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Reduce the Risk of Tin Whiskers
Tin whiskers can create shorts and threaten electronic system reliability. Explore the causes of tin whisker growth and learn how component tinning and robotic hot solder dip processing can help mitigate the risk.
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Viewpoint
January 20, 2026

Marie-Josée Turgeon, CEO, C2MI

Transformative technologies are now available at C2MI – Our Vision for 2026
As we look ahead to 2026, C2MI is entering one of the most transformative periods in its history. Major investments are now positioning our centre as a global reference point for next-generation semiconductor innovation.

Among the most significant milestones is the deployment of Canada's first and the world's only pure play superconducting quantum chip foundry. This new infrastructure will enable companies, researchers, and startups to prototype, iterate, and scale quantum devices with a level of accessibility and industrial readiness unmatched worldwide.

In parallel, C2MI is expanding its advanced packaging and advanced sensor capabilities to support the rapidly growing demand for highly integrated, high-performance systems. These additions will allow our ecosystem to accelerate development cycles in emerging markets such as artificial intelligence, quantum technologies, edge computing, and next-generation communications.

Throughout this expansion, C2MI continues to rely on its proven RTO model, which bridges the gap between breakthrough ideas and commercially viable products. By combining industrial-grade manufacturing, research excellence, and collaborative project execution, we remain committed to enabling companies to innovate faster and de-risk their path to market.

In 2026, C2MI will not simply grow—it will redefine what open, industry-driven innovation can achieve for Canada and for the global tech community.

Marie-Josée Turgeon
CEO, C2MI
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Henkel AG & Co.
Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
Automated Solder Ball Placement for WLCSP Flip Chip