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The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
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StratEdge Corporation
Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
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Viewpoint
January 15, 2026

Anika Baumhauer, International Strategy & Sales Manager, SONOTEC GmbH

In 2025, we worked diligently on our vision 2030. Outlining our corporate strategy gives us a clear picture of our goals and how to achieve them. In 2026, our focus will be on product development, expanding strategic markets, and continuous growth.

We will invest heavily in our non-contact flow meter series SEMIFLOW. Expanding our manufacturing capacities is another key element of our strategy. We have acquired another building to meet growing demand for our compact clamp-on flow sensors.

Global challenges do not leave us unscathed. In the United States, we are dealing with increasing regulatory requirements, which we will continue to address in 2026. We are also working on optimizing our supply chains and streamlining international trade.

However, we see great potential in Silicon Saxony, our local environment. As a global innovation hub for the semiconductor industry, the region's growth provides us with many chances to collaborate with leading technology companies and opens up new business opportunities.

With our strategy for 2030 and our detailed plans for 2026, we are well-positioned to further expand our market share as a leading ultrasonic flow sensor supplier and ensure long-term success as a key player in the global technology industry.

Anika Baumhauer
International Strategy & Sales Manager, Non-Invasive Fluid Monitoring, SONOTEC GmbH
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Brewer Science
Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
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