Isabella Drolz, Global Head Division IXS, VP Commercial, Comet

In the semiconductor industry, the zero-defect approach demands consistent quality management along the process development and production chain. Comet provides high-tech X-ray inspection solutions for crucial production phases, such as TSV filling in wafer processing or die attach in chip-level bonding.

In 2025, we introduced a new configuration of our CA20 inspection solution, adapted to handle the strict requirements of handling delicate wafers and equipped with AI powered real-time metrology.

In 2026, we will continue to develop our technology further, increasing throughput, adding new defects to our ADR technology and collaborating closely with customers to further reduce cost, shorten time-to-market, and increase yield.

Our commitment to driving innovation within the industry is reflected in our involvement in the JOINT3 Consortium, a co-creation evaluation framework established by Resonac Corporation with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies.

Next year and beyond, Comet will be contributing its expertise in advanced x-ray systems to help push the boundaries of inspection capabilities beyond traditional solder-joint analysis, actively addressing not only the needs of today's applications, but engaging in technologies that will define tomorrow's industry.