Andy Behr, Technology Manager, Panasonic Electronic Materials

The IC packaging industry is undergoing a transformative shift as traditional transistor scaling approaches its theoretical limits.

Advanced packaging technologies—such as 2.5D and 3D integration, hybrid bonding, and copackaged optics are becoming critical enablers of performance for AI, and 5G applications. These innovations deliver higher bandwidth, lower power consumption, and improved thermal management are redefining how chips are packaged and assembled.

At Panasonic's Electronic Materials Division, we are at the forefront of this evolution. Our portfolio of materials includes high-reliability encapsulants for wafer-level and laminate packages, advanced LEXCM substrates for high-speed communication, and pioneering materials for panel-level packaging.

By developing epoxy mold compounds, molded underfills, and liquid encapsulants optimized for fan-out and compression molding, we enable customers achieve superior processability and long-term reliability in demanding environments.

As heterogeneous integration accelerates, material science will play a decisive role in unlocking next-generation semiconductor performance. At Panasonic, our commitment is clear: deliver innovative packaging solutions that empower the industry to meet the challenges of miniaturization, thermal efficiency, and sustainability - driving progress for a connected world.