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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
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StratEdge Corporation
Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
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Viewpoint
January 6, 2026

Brad Ferry, Director of Business Development, Circuit Technology Center

2025 continued a strong trajectory of record-breaking performance at Circuit Technology Center. We strengthened our position as a trusted provider of high-reliability rework and repair services, with growing demand across complex board-level rework, BGA reballing, component tinning, and component salvage.

This comes as the electronics industry increasingly prioritizes sustainability and circularity. Notably, our CEO, Jeff Ferry, is serving as chair of a new IPC committee dedicated to establishing industry standards for the proper removal and reuse of electronic components.

Our support for mission-critical OEMs and assembly partners expanded significantly this year. We streamlined reclaim and component tinning operations to improve both quality and throughput, and we continued to invest in automation. We added two additional Robotic Hot Solder Dip (RHSD) machines, bringing our total to six. This added capacity enhances our ability to support the growing need for tin whisker mitigation and lead finish conversion for high-reliability components.

We also made strategic progress in expanding our national reach, particularly on the West Coast. With the launch of a new rep partnership with Restronics Southern California, we've established a foothold in one of the most important defense and aerospace hubs in the country. Our structured rep model and targeted outreach efforts have already begun to generate meaningful traction in that region.

Most importantly, we continued to invest in the people and capabilities that fuel our long-term success. We welcomed an experienced machinist to meet rising demand for precision drilling of undefiled BGAs, and expanded our business development and account management functions to better support our growing customer base. With a culture rooted in transparency, accountability, and technical excellence, we're not just growing, we're building a sustainable foundation for the future.

Thank you to every member of the CTC team for making 2025 such a standout year. After 42 years in business, it still feels like we're just getting started.

Brad Ferry
Director of Business Development, Circuit Technology Center
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Brewer Science
Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
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Openair Plasma for Semiconductor Manufacturing