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Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
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Reduce the Risk of Tin Whiskers
Tin whiskers can create shorts and threaten electronic system reliability. Explore the causes of tin whisker growth and learn how component tinning and robotic hot solder dip processing can help mitigate the risk.
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Viewpoint
February 19, 2025

Ross Berntson, President and CEO, Indium Corporation

Has your company been affected by the U.S. ban on advanced semiconductor production in China?
The U.S. ban on advanced semiconductor production in China has presented challenges, but every challenge is an opportunity to change and innovate and make us stronger. "Agility" is the key to responding to an ever-changing regulatory environment.

We've strengthened our relationships with our global suppliers and continued to explore new measures to enhance our supply chain. Investment in R&D and innovations in operations also help position us to be more resilient and competitive in the long term.

Is your company using Artificial Intelligence (AI) tools?
We don't just use AI tools; our materials play a vital role in advancing the hardware needed for more powerful AI and its broader applications. Innovation is at the heart of what we do, evident not only in our products and services but also in our day-to-day operations. AI is a key component of our business strategy. From leveraging AI-powered analytics to boost efficiency, to utilizing AI tools for image management, we are committed to exploring new ways AI can enhance our operations and deliver greater value to our customers.

Will you be launching new products or services in 2025?
Curiosity drives Indium Corporation, and innovation lies at the core of everything we do. We are preparing to launch a variety of cutting-edge products tailored to meet the changing demands of electronics assembly and packaging. These include advanced packaging materials and metal thermal interface materials designed to support high-performance computing.

What is the outlook for your company in 2025?
Despite global economic uncertainties, we are optimistic that the electronics market will grow and confident in our plans for 2025. Our growth is grounded in focusing on the right applications and markets.

By staying nimble, we believe 2025 will be a year of continued innovation and growth by partnering with and creating value for our customers and the industries we serve. We believe that material science changes the world and will continue to focus on innovation in all aspects of our business.

Ross Berntson
President and CEO, Indium Corporation
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Henkel AG & Co.
Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
Automated Solder Ball Placement for WLCSP Flip Chip