semiconductor
packaging news
Sponsor
Ontos
Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos
Essential Practices for Gold Mitigation of Electronic Components
Sponsor
Amkor Technology, Inc.
Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.
Viewpoint
February 17, 2025

Joseph R. Montano, President and CEO, Delphon Industries

As we look toward 2025, Delphon Industries is poised to meet the evolving demands of the semiconductor industry with a focus on innovation, operational excellence, and customer collaboration. Despite ongoing market headwinds, including the slowdown in advanced semiconductor production in China, we see significant opportunities for growth, particularly in Southeast Asia.

Our Gel-Pak and UltraTape product lines are uniquely positioned to support advanced packaging, wafer test, and critical environment solutions required for high-growth markets such as AI, automotive, and high-performance computing.

To align with industry trends, we've prioritized customer-centric innovation and operational efficiency. By enhancing our New Product Introduction (NPI) process, we are accelerating the development of solutions like Gel-Probe, a groundbreaking material designed for advanced wafer-level testing that improves yield and performance.

Strategic partnerships, such as our collaboration with Daewon, JEM, Tier 1 OEMs and new highly qualified representatives across North America, will further expand our global reach and strengthen our ability to serve key semiconductor hubs.

At Delphon, we are also embracing the role of Artificial Intelligence (AI) to optimize operations, streamline supply chains, and support data-driven decision-making. By leveraging AI tools, we can better address customer challenges and ensure our solutions meet the increasingly complex demands of the semiconductor ecosystem.

Our outlook for 2025 is ambitious but clear: Drive growth through innovation, strengthen our customer relationships, and elevate operational scalability. Delphon remains committed to delivering solutions that enable our customers to produce next-generation technologies while remaining resilient and adaptable in a dynamic global market.

Joseph R. Montano
President and CEO, Delphon Industries
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma® & PlasmaPlus®.
Plasmatreat GmbH
Inline Plasma