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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
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Viewpoint
February 17, 2025

Joseph R. Montano, President and CEO, Delphon Industries

As we look toward 2025, Delphon Industries is poised to meet the evolving demands of the semiconductor industry with a focus on innovation, operational excellence, and customer collaboration. Despite ongoing market headwinds, including the slowdown in advanced semiconductor production in China, we see significant opportunities for growth, particularly in Southeast Asia.

Our Gel-Pak and UltraTape product lines are uniquely positioned to support advanced packaging, wafer test, and critical environment solutions required for high-growth markets such as AI, automotive, and high-performance computing.

To align with industry trends, we've prioritized customer-centric innovation and operational efficiency. By enhancing our New Product Introduction (NPI) process, we are accelerating the development of solutions like Gel-Probe, a groundbreaking material designed for advanced wafer-level testing that improves yield and performance.

Strategic partnerships, such as our collaboration with Daewon, JEM, Tier 1 OEMs and new highly qualified representatives across North America, will further expand our global reach and strengthen our ability to serve key semiconductor hubs.

At Delphon, we are also embracing the role of Artificial Intelligence (AI) to optimize operations, streamline supply chains, and support data-driven decision-making. By leveraging AI tools, we can better address customer challenges and ensure our solutions meet the increasingly complex demands of the semiconductor ecosystem.

Our outlook for 2025 is ambitious but clear: Drive growth through innovation, strengthen our customer relationships, and elevate operational scalability. Delphon remains committed to delivering solutions that enable our customers to produce next-generation technologies while remaining resilient and adaptable in a dynamic global market.

Joseph R. Montano
President and CEO, Delphon Industries
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Brewer Science
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Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
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