Jayson Moy, Director of Global Product Management, KYZEN

KYZEN has a long history of working with global leaders in the semiconductor and advanced packaging industries to develop cleaning materials that address the challenges that come with new technologies.

While production has primarily been in Asia, we see that other areas of the world are starting to implement policies that will bring the migration of Semiconductor manufacturing to their areas as the market expands.

The continuous need for faster and smaller devices drives new technologies in manufacturing semiconductor products, this is especially true for the quickly emerging AI industry and for those that use it. This has played a large role in paving the way for KYZEN to develop chemistries that will add value to the AI developers of process and hardware to enhance the reliability of their new technologies.

Several new chemistries are being launched this year within our Advanced Packaging product line. These are targeted towards emerging Semiconductor technologies, including AI. They will join a well-rounded Micronox product line to encapsulate the growing need to clean in a variety of applications.

With these product additions and the realization that Cleaning is a value-added benefit to their semiconductor manufacturing processes, our outlook for 2025 is optimistically hopeful and KYZEN will continue to address the needs of the industry as the technological leader in Cleaning.