Uwe Wagner, Chief Executive Officer, 3D-Micromac AG

Accelerating Failure Analysis to Keep Pace with Semiconductor Growth

As we enter 2025, the semiconductor industry's rapid expansion places immense pressure on production processes and quality control. Failure analysis (FA), a critical step in ensuring reliability and performance, must adapt to these growing demands. Traditional FA workflows often involve time-consuming sample preparation steps, delaying critical insights and slowing problem resolution.

Mechanical sample preparation methods are often tedious and introduce significant mechanical stress to the sample, which can lead to artifacts and alter the pristine state of the material. Ion-based preparation methods, though highly accurate, require significant time investment for each sample.

Laser-based sample preparation, such as 3D-Micromac's microPREP PRO, addresses the limitations of both approaches. Laser-based sample preparation methods can prepare samples quickly without introducing mechanical stress, preserving the integrity of the sample while also reducing time-to-sample from hours to minutes. Thus, manufacturers can accelerate the feedback loop between production and FA teams, minimizing material loss while maximizing yield.

In a world where every second counts, enhancing FA is not just about solving problems—it's about driving productivity and maintaining the trust of a rapidly growing market. As we progress through 2025, our commitment is to empower the
semiconductor industry with tools that meet its ambitions for scale, speed, and excellence.