Ramachandran "Ram" K. Trichur, Global Market Segment Head, Henkel

AI and high-performance computing (HPC) applications have dominated growth in the semiconductor industry over the last year. While other sectors, including automotive, were less dynamic in 2024, the future looks promising.

Indeed, data center expansion will continue to fuel 2025 market growth, but analysts also predict notable recovery in automotive driven by increased EV adoption in Europe and China, as well as accelerated integration of ADAS, infotainment, and connectivity technologies across vehicle categories worldwide.

With a strong portfolio in advanced packaging and wirebond semiconductor materials, Henkel enables technological progress in nearly all semiconductor packaging applications – from AI to mobile devices to automotive. Notably for power devices, last year we developed and debuted high thermal die attach materials for wide-bandgap semiconductors and LOCTITE ABLESTIK ABP 8068TH, a pressure-less sintering die attach adhesive with thermal conductivity of 150 W/m-K.

Addressing the 2.5D and 3D packages integral to AI and HPC, Henkel expanded our offerings in 2024, commercializing fast flow, void-free capillary underfill LOCTITE ECCOBOND UF 9000AE, designed for large body advanced packages, and LOCTITE ECCOBOND LCM 1000AG-1, an ultra-low warpage, high-reliability LCM wafer-level overmold material.

Building on this success, the pipeline for the coming year is equally as consequential, with a large die sintering material, a high thermal conductivity die attach film, and a new capillary underfill with high thermal characteristics set to be commercialized in 2025. Sustainability remains a priority within the entire product range as we work to eliminate chemicals of concern as part of Henkel’s responsible chemistry pledge.

Regarding global trade dynamics and pending tariff concerns, supply chain realignment and geopolitical uncertainty will undoubtedly present challenges. However, Henkel’s global manufacturing footprint, support resources, and innovation teams are geographically diverse, allowing us to support regional demands and satisfy technical requirements anywhere in the world and giving customers confidence that needs will be met no matter the geopolitical climate.