semiconductor
packaging news
Sponsor
KYZEN
Cu Pillar Flip Chip Cleaning
Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.
KYZEN
Explore the Art of Wirebonding
Sponsor
Ontos
Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos
Viewpoint
February 4, 2025

Anthony Gallegos, Global Product Manager, Semiconductor Technology, Technic

With the increasing demand for materials in silicon photonics—a market projected to grow from $2.7 billion in 2024 to $15.8 billion by 2032—Technic is revisiting its legacy AuSn process. Elevate AuSn 8020, developed over 15 years ago, deposits an 80/20 Au/Sn alloy (or variations) from a one-step plating bath. While effective, the legacy process is highly sensitive to current density, making optimization time-consuming (3-4 months) and limiting its ability to meet today's demand.

To address this, Technic launched an R&D project this year to improve the process. Last month, an interim version of the electrolyte was released, utilizing the same chemistries in a modified ratio to produce smoother deposits and better alloy control.

Simultaneously, Technic is developing an entirely new AuSn process to overcome current limitations. With over 100 formulations tested, two promising candidates have emerged. While results are close to the target, further refinement is ongoing to finalize the process.

Technic expects to commercialize the new AuSn bath by Q2 2025. This next-generation process will enable easy alloy control and consistent results across various high-volume manufacturing tools, ensuring Technic can meet the surging demand in the rapidly growing silicon photonics industry.

Anthony Gallegos
Global Product Manager, Semiconductor Technology, Technic
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Innovation in Every Drop