Minoru Inoue, Branch Manager of Semiconductor Materials Sales Branch, Sekisui Chemical

Driven by consistent investment in AI-servers, advanced logic and memory saw a significant recovery in 2024. In the future, due to the U.S.-China trade friction with semiconductors, there is a possibility that market conditions may show dynamic movements, such as excessive product inventories and sudden suspension of trading, however, we still expect continued growth in 2025 and expect it to be an even better year.

In response to these strong demand and expectations in the market, last year our company announced an expansion of production capacity of UV release tape "SELFA", which has excellent heat and chemical resistance.

Last year, we also announced epoxy flux as a new product. This product can improve process efficiency and package reliability, and reduces form factors. In addition to SnBi solder type, we announced a high-temperature type for SAC solder, and plan to promote sample work for a variety of applications and customers in 2025.

Sekisui Chemical Group also provides a variety of products and solutions to the semiconductor industry, including low-dielectric buildup films for FCBGA, heat dissipation materials (TIM), high-resolution inkjet systems, etc.

Last year, our company announced the establishment of a new R&D base in Hsinchu, Taiwan, where evaluation and prototyping of products in the semiconductor field can be conducted. Full-scale operation is scheduled for the first half of 2025, and we aim to anticipate and strengthen responses to increasingly sophisticated needs, accelerate new development, and expand adoption.