Mike Dube, Executive Vice President of Manufacturing Operations & Engineering, Rochester Electronics

In 2025, Rochester Electronics will introduce new products and services to meet the rising demand for long-lifecycle solutions and address supply chain obsolescence challenges.

We're enhancing domestic manufacturing for hermetic and plastic assembly packaging for the military, industrial, medical, and automotive sectors. This involves supporting hermetic hybrid multichip packages, expanding plastic packaging with legacy lead-frame solutions for PLCC and QFP, and adding QFN and BGA leadless packages.

Rochester is enhancing its capabilities for military applications requiring lead solder for lead-frame and ball grid array products. We offer hot solder dip and re-balling services to meet these critical needs.

AI tools are integral to our operations, helping optimize manufacturing, enhance quality control, and improve supply chain management. This assists delivery of faster, more precise, and more reliable solutions to our customers.

Resolving supply chain shortages has strengthened our ability to meet customer demands. Collaborating with universities and high schools fosters a skilled workforce, while our feeder programs nurture future engineers and technicians, supporting our commitment to onshore manufacturing excellence.

Rochester continues to see long-term growth in supporting customers requiring semiconductor components for long-life applications. We offer onshore domestic manufacturing solutions to mitigate supply chain issues and address obsolescence in mission-critical systems.