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DL Technology
Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
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StratEdge Corporation
Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
Viewpoint
January 27, 2025

Marie-Josée Turgeon, CEO, C2MI

Shaping the Future of Innovation in Canada – Our Vision for 2025

In 2025, our focus is clear: to catalyze transformative solutions, empower Canadian talent, and create a sustainable, forward-thinking manufacturing industry. Together, we are shaping the future of innovation, making Canada a powerhouse in the global semiconductor landscape.

As Canada’s largest R&D facility, C2MI is dedicated to driving innovation and strengthening the national technology ecosystem. Our commitment to advancing Canada’s leadership in emerging technologies is focused on three mainstream technologies: quantum hardware manufacturing, advanced packaging and advanced sensors technologies.

With major investments including an extension to support these new technologies, C2MI intends to play a major role in the development of hardware for quantum solutions and work with partners to develop the most advanced packaging solutions for the next generation of AI products. With a focus on sustainability, we are a proud and very active member of the SEMI Climate Consortium, using our state-of-the-art facility to develop sustainable manufacturing technologies for semiconductors.

Additionally, we are playing an integral role in the implementation and reinforcement of the Northeast Semiconductor Manufacturing Corridor. This initiative is also supported by the Canadian Semiconductor Council (CSC) and Quebec’s Innovation Zones and is pivotal in advancing the semiconductor industry by driving innovation, enhancing manufacturing, and boosting economic growth to advance the future of semiconductors.

In summary, 2025 is poised to be a year of dynamic growth and innovation. With a clear vision and unwavering dedication, we are set to achieve remarkable milestones and redefine industry standards.

Marie-Josée Turgeon
CEO, C2MI (MiQro Innovation Collaborative Centre)
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Brewer Science
Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Openair Plasma for Semiconductor Manufacturing