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Determining Chemistry Compatibility and Solubility Comparison for Cu Pillar Flip Chip Cleaning



Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.

KYZEN

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Paper Download Name List



Date            Name Email Company Country/State
09-18-2024 Lynne T Schueler lschueler@circuitnet.com Circuitnet Massachusetts
09-30-2024 Anne-Kathrine Knoph anne-kathrine.knoph@ericsson.com Ericsson AB Sweden
09-30-2024 Arijit Koley arijit.koley@intel.com Intel Oregon
09-30-2024 KIM SEOG SOON sgsnkim@unijet.co.kr UniJet Co., Ltd. 미국
10-01-2024 Aimee Morey aimee.morey@frontgrade.com Frontgrade Technologies Colorado
10-01-2024 Yiping Yao yyao@us.ibm.com IBM United States
10-01-2024 Andrew Romano radmon@gmail.com Anric Technologies, LLC MA
10-01-2024 Arjan Hovestad arjan.hovestad@besi.com Besi Netherlands
10-01-2024 Arjan Hovestad arjan.hovestad@besi.com Besi Netherlands
10-01-2024 Arijit Koley arijit.koley@intel.com Intel Oregon
10-01-2024 Kelsea Johnson kelseaj@qti.qualcomm.com Qualcomm CA
10-01-2024 Kevin D Lindsey Kevin.Lindsey@henkel.com Henkel United States
10-01-2024 GAURAV MEHROTRA gaurav.mehrotra.uw@renesas.com RENESAS United States
10-01-2024 BS Kong kongku@kccworld.co.kr KCC Corporation Republic of Korea
10-01-2024 Lip Teng Saw lip.teng.saw@wdc.com Western Digital Malaysia
10-01-2024 SEUNG-MOO LEE smlee01@hites.co.kr TES Co., Ltd. SOUTH KOREA
10-01-2024 Ng Jin Naa jnng@unisemgroup.com Unisem (M) Berhad Malaysia
10-02-2024 Akash Chandrakant Jadhav jadhav.akash1499@gmail.com Arizona State University ARIZONA
10-02-2024 Lucille Jones lucille.jones@webreporttech.com Webreporttech NORTH CAROLINA
10-02-2024 Sylvain Irénée Misat smisat@kns.com Kulicke & Soffa Liteq B.V. Netherlands
10-02-2024 koen kennes koen.kennes@imec.be imec Belgium
10-02-2024 Chauvigne eric.chauvigne@chemours.com Chemours Switzerland
10-02-2024 Eric Perfecto eric.perfecto1@ibm.com IBM US
10-02-2024 Tanuj Ravikumar tanuj.gowda18@gmail.com asu AZ
10-02-2024 meet panchal meetpanchal851@gmail.com ARIZONA STATE UNIVERSITY ARIZONA
10-02-2024 kouji oosawa kouji_oosawa@nidek.co.jp NIDEK Japan
10-03-2024 Takayoshi Mori mori.takayoshi@jp.panasonic.com Panasonic Connect 日本
10-04-2024 Xiaoying Guo xyguo3@gmail.com Intel United States
10-06-2024 BS Kong kongku@kccworld.co.kr KCC Corporation Republic of Korea
10-07-2024 Barb Young byoung@kcnsc.doe.gov Honeywell mo
10-07-2024 Arijit Koley arijit.koley@intel.com Intel Oregon
10-07-2024 Jeroen Van Duren jeroen@df.com Diamond Foundry CA
10-07-2024 kouji oosawa kouji_oosawa@nidek.co.jp NIDEK Japan
10-10-2024 Jihoon Choi cjh@aqlaser.com AQLASER South Korea
10-11-2024 Markus Schindler markus.schindler@delo.de Delo Industrial Adhesives Deutschland
10-15-2024 l l l l
10-16-2024 Bert Chung Bert_Chung@bhtsolution.com BHT N/A
10-17-2024 Benjamin Jurcik benjamin.jurcik@airliquide.com Air Liquide DE
10-18-2024 Mumtaz Bora mbora@psemi.com pSemi United States
10-21-2024 Albert albertthiaa@gmail.com IME Singapore
10-21-2024 Leena Saku lsaku@qti.qualcomm.com Qualcomm Global Trading Pte Ltd Singapore
10-22-2024 OSAMU SUZUKI osamu.suzuki@rapidus.co.jp Rapidus US, LLC New York
10-24-2024 Yiping Yao yyao@us.ibm.com IBM United States
10-24-2024 chengzhao chengzhao10@huawei.com huawei china
10-28-2024 Bart Berenbak bart.berenbak@besi.com Besi Netherlands
10-28-2024 R Horner rhorner@synopsys.com Synopsys CA
10-29-2024 torey tomaso torey.tomaso@macdermidalpha.com macdermid IL
10-29-2024 Arijit Koley arijit.koley@intel.com Intel Oregon
10-29-2024 Donn Forbes df@donnforbes.com Arasil, Inc. OR
10-29-2024 HanSung Lee hansung.lee@daeduck.com Daeduck Electronics 대한민국
10-29-2024 Ron Chang ron.chang@nxp.com NXP Taiwan
10-31-2024 Ryan Mackiewicz ryan.mackiewicz@intel.com Intel Corporation United States
10-31-2024 Tom Dory tom_dory@ITMconsluting.com ITM Consulting United States
10-31-2024 Keith Tan kaykit.tan@heraeus.com Heraeus Materials Singapore Pte. Ltd. Singapore
11-01-2024 g g g g
11-01-2024 Jack Wang yongqian.wang@medtronic.com Medtronic Arizona
11-03-2024 Shelton Lu sheltonlu@via.com.tw VIA Technologies 台灣
11-04-2024 Megan Chang meganchang@ti.com Texas Taiwan
11-04-2024 Ravi R.Parthasarathy@zestronUSA.com Zestron VA
11-05-2024 Jonathan Abdilla jonathan.abdilla@besi.com BESI Austria GmbH tyrol
11-07-2024 Dan Fazari dan.fazari@nokia.com Nokia Canada
11-07-2024 choi kh81.choi@samsung.com samsung 대한민국
11-12-2024 Jian Tan jian_tan@pall.com Pall Corporation US
11-14-2024 Shyam Nair shyamnair@my.unt.edu University of North Texas Texas
11-18-2024 Oliver M Chyan oliverm.chyan@unt.edu University of North Texas United States
11-18-2024 Dinesh Kumar dineshkumarkumaravel@my.unt.edu University of North Texas Tamil Nadu
11-18-2024 Shyam Nair shyamnair@my.unt.edu University of North Texas TX
11-18-2024 Jeffrey K Kennedy jeffreykkennedy@yahoo.com GreyFox United States
11-18-2024 Anushka Perera AnushkaPerera@my.unt.edu UNT United States
11-18-2024 Bert Chung Bert_Chung@allter.com.tw Allter N/A
11-21-2024 Elwin elwin_heng@yahoo.com Intel Malaysia
11-21-2024 HH hsinhao.liao@narlabs.org.tw TSRI Taiwan
11-22-2024 Christina Seeholzer cmseeholzer@hrl.com HRL CA
11-25-2024 Shripad Gokhale shripad.gokhale@intel.com Intel Corp United States
11-25-2024 Marie-Josée Gour Marie-Josee.Gour@USherbrooke.ca Université de Sherbrooke QC
11-25-2024 Adam Tsai Adam.tsai@amkor.com Amkor Taiwan
11-25-2024 Hans Ohman hans.ohman@sanmina.com Sanmina Canada
11-25-2024 KIM SEOG SOON sgsnkim@unijet.co.kr UniJet Co., Ltd. 미국
11-25-2024 Jessica Ho jessho@qti.qualcomm.com RF360 Singapore
11-26-2024 Vijay Mohan Sajja vijay.sajja@nevadanano.com Nevada Nanotech Systems Inc United States
11-26-2024 Ed Marvin Calara marboe32@gmail.com SPIL California
12-02-2024 Michael Nieves Calderon mcalderon8@gatech.edu Georgia Tech Georgia
12-04-2024 Steen Weichel stwe@demant.com Demant A/S Denmark
12-04-2024 Steven Tu steven.tu@dupont.com DuPont United States
12-05-2024 Powen Hsiao powen_hsiao@unimicron.com Unimicron Technology Corp. Taiwan
12-05-2024 Ng Jin Naa jnng@unisemgroup.com Unisem (M) Berhad Malaysia
12-05-2024 Paul sweesan.lim@infineon.com Infineon Technologies Singapore
12-10-2024 Megan lechocolatdeh@gmail.com NTU Taiwan
12-10-2024 Megan lechocolatdeh@gmail.com TI Taiwan
12-10-2024 Megan lechocolatdeh@gmail.com NTU Taiwan
12-17-2024 Pete Green p.green@ram-innovations.com RAM Innovations Ltd United Kingdom
12-19-2024 Javier Falcon javier.falcon@viasat.com Viasat AZ
12-23-2024 Ajit Salunke ajit.salunke@macdermidalpha.com Macdermid Alpha Electronics Solutions India
12-24-2024 Steven Davidson steven.davidson@ngc.com Northrop Grumman IL
01-07-2025 Brian Mooney bmooney@sacheminc.com SACHEM, Inc. Texas
01-07-2025 Marie-Josée Gour Marie-Josee.Gour@USherbrooke.ca Université de Sherbrooke QC
01-07-2025 Katleen Timbol katfajtimbol@yahoo.com TI TX
01-07-2025 KIM SEOG SOON sgsnkim@unijet.co.kr UniJet Co., Ltd. 미국
01-07-2025 NAARASHIMAN NAIDU A/L GUNASEGARAN naarashiman-naidu.gunasegaran@keysight.com Keysight Technologies Malaysia
01-07-2025 Rose Guino Rose.guino@henkel.com Henkel CA
01-08-2025 Slavia Dsouza slaviadsouza@ram-innovations.com RAM Innovations United Kingdom
01-10-2025 lim paul sweesan.lim@infineon.com Infineon Technologies Singapore
01-10-2025 Alex T.yeo@mitsui.com Mitsui Singapore
01-13-2025 Hideto Fujibuchi hideto.fujibuchi@plasmatreat.de Plasmatreat Deutschland
01-13-2025 Cameron Dawes cameron.dawes@us.tel.com TEA NM
01-15-2025 Gabriele SALA salag@virgilio.it GSConsulting - Leibero Professionista Italia
01-15-2025 Jessica Ho jessho@qti.qualcomm.com RF360 Singapore
01-16-2025 Jeff Grover jeffrey.grover@henkel.com Henkel United States
01-16-2025 Ganesh Thothadri ganesh.thothadrri@ifciltd.com IFCI India
01-17-2025 eunhee jung eh9904.jung@samsung.com Samsung Electronics Co., Ltd. 대한민국
01-26-2025 Park Jong Eun je0429.park@samsung.com Samsung Electronics 일본
01-29-2025 Jinwoo Chung Jinwoo.Chung@mitsuichemicals.com Mitsui Chemicals 日本
01-30-2025 Jinho Lee jhlee@keti.re.kr KETI 대한민국
02-04-2025 Russell Russell.lo@hermes.com.tw Hermes Taiwan
02-04-2025 bob chylak bchylak@kns.com Kulicke and Soffa Pennsylvania
02-04-2025 Norman Li norman.li@aseus.com ASE United States
02-04-2025 Siva Sivasankar rsivasankar@google.com Google CA
02-04-2025 Rajendra Pendse rajd@meta.com meta CA
02-04-2025 Marin Gheorghe maringhe@nanom-mems.com NANOM MEMS srl Romania
02-05-2025 Ng Jin Naa jnng@unisemgroup.com Unisem (M) Berhad Malaysia
02-05-2025 Anke Zitzelseberger anke.zitzelsberger@intel.com Intel Deutschland
02-05-2025 Richard Lindman richard.lindman@ericsson.com Ericsson Sweden
02-14-2025 Victor Henriques vitor.henriques@amkor.com Amkor Portugal SA Portugal
02-14-2025 Dr. Tom Dory tom_dory@ITMconsulting.com ITM Consulting United States
02-17-2025 Ruth Pegington rpegington@cdtltd.co.uk CDT Ltd UK
03-03-2025 Raj Pendse rajd@meta.com Meta CA
03-03-2025 yiping yao yyao@us.ibm.com ibm United States
03-03-2025 Shiro Tan shiro.tan@fujifilm.com FUJIFILM Electronic Materials Japan
03-03-2025 Vincent Wang vincent.wang@winstek.com.tw winstek 台灣
03-03-2025 KIM SEOG SOON sgsnkim@unijet.co.kr UniJet Co., Ltd. 미국
03-04-2025 Steen stwe@demant.com Demant Denmark
03-04-2025 Sharyl Maraviov sharyl@pctsystems.com PCT Systems Inc CA
03-05-2025 Isabel de Sousa idesousa@ca.ibm.com IBM CANADA Canada
03-09-2025 Yoram Naor yoram.naor@ci-semi.com CI Systems / SEMI div. Israel
03-11-2025 Anke Zitzelseberger anke.zitzelsberger@intel.com Intel Deutschland
03-13-2025 MICHAEL ANTHONY CIVIELLO michael@aagraconsulting.com aagra consulting LLC AZ
03-31-2025 Karl Nicolaus knicolau@qti.qualcomm.com RF360 Europe GmbH Germany
03-31-2025 Arjan Hovestad arjan.hovestad@besi.com Besi Netherlands
03-31-2025 David Arbow david.n.arbow@intel.com Intel United States
03-31-2025 Dr. Tom Dory tom_dory@ITMconsulting.com ITM Consulting United States
03-31-2025 ZHANG TONGLONG tonglong.zhang@huawei.com hisilicon 中国香港特别行政区
03-31-2025 Keith Tan kaykit.tan@heraeus.com Heraeus Materials Singapore Pte. Ltd. Singapore
04-08-2025 Abdelhamid ElSawy abdelhamid.elsawy@macdermidalpha.com Macdermid Alpha United States
04-08-2025 Xike Zhao xzhao@hellerindustries.com Heller Industries United States
04-08-2025 Gautam Verma gverma2@gmail.com Self CA
04-08-2025 Dale Ohmart d-ohmart@ti.com Texas Instruments Texas
04-10-2025 chengzhao chengzhao10@huawei.com huawei china
04-23-2025 torey tomaso torey.tomaso@macdermidalpha.com macdermid IL
04-23-2025 Gwen Moran gmoran@advantivtech.com Advantiv Technologies, Inc Pennsylvania
04-23-2025 Sanjay Malik sanjay.malik@screen-spe.com SCREEN United States
04-23-2025 David Chang david2@raycon.com Raycon CA
04-24-2025 Fulin Zheng fulin.zheng@nexperia.com Nexperia Hong Kong SAR
04-24-2025 胡凯 hukai67@huawei.com 华为海思 中国
04-24-2025 chengzhao chengzhao10@huawei.com huawei china
04-30-2025 Arjan Hovestad arjan.hovestad@besi.com Besi Netherlands
04-30-2025 SteveSwen steves@icproto.com QP Technologies CA
05-14-2025 Yves larrouturou yves.larrouturou@fr.thalesgroup.com Thales France
05-14-2025 Yan Mu molichengxiao@gmail.com Intel AZ
05-16-2025 chenchuang chenchuang23@hisilicon.com huawei China
05-18-2025 Lip Teng Saw lip.teng.saw@sandisk.com SanDisk Storage Malaysia Penang, Malaysia
05-18-2025 Lip Teng Saw lip.teng.saw@sandisk.com SanDisk Storage Malaysia Penang, Malaysia
05-19-2025 Wayne wayne-hc.tang@broadcom.com Broadcom Singapore
05-27-2025 Hideto Fujibuchi hideto.fujibuchi@plasmatreat.de Plasmatreat GmbH Germany
05-28-2025 Golden Golden@finge.de Finge Burundi
05-28-2025 Martin vagues Martin.Vagues@axiro.com Axiro CA
05-30-2025 m m m m
06-02-2025 chenchuang chenchuang23@hisilicon.com huawei China
06-11-2025 ANBU SELVAM anbu.selvam74@gmail.com INTEL ELECTRONICS PULAU PINANG
06-12-2025 Scott Franklin Cain scott_cain@kyzen.com KYZEN United States
07-14-2025 Jacek Tomaszewski jtomaszewski@semicon.com.pl Semicon Ltd Polska
07-14-2025 Torey Tomaso Ttomaso@yahoo.com macDermid IL
07-14-2025 James Bond james@bond.com James CA
07-30-2025 Faharia Hasan Bhuiyan bhuiyaf@purdue.edu Purdue University United States
07-30-2025 Dsvid Yoon dhyoon60@naver.com Unitouh Korea South of Korea
07-31-2025 Jungsik Choi jschoi@shekoykorea.com Shekoy Korea South Korea
08-21-2025 HAK SUNG KIM kima@hanyang.ac.kr Hanyang university 서울특별시
08-21-2025 lim paul sweesan.lim@infineon.com Infineon Technologies Singapore
08-26-2025 Karel Cote karel.cote@c2mi.ca C2MI Quebec
08-26-2025 Emilio emilio.tarango.valles@intel.com Intel United States
08-26-2025 TORU MAEDA maedatoo@yamaha-robotics.com YAMAHA ROBOTICS CO.,LTD. 日本
09-22-2025 Hannah Harlos hannah.harlos@pvatepla.com PVA TePla AG Deutschland
09-29-2025 Keith Tan kaykit.tan@heraeus.com Heraeus Materials Singapore Pte. Ltd. Singapore
10-02-2025 Ken Mays ken.w.mays@gmail.com KMays Technical Services US
10-17-2025 thomas thomas.ochsenreiter@tecnotal.net tecnotal Liechtenstein
10-17-2025 Robert Hallock robert.b.hallock@rtx.com RTX MA
10-17-2025 Ioan Tempea ioan.tempea@mda.space MDA Space Canada
10-17-2025 Jonathan Abdilla jonathan.abdilla@besi.com BESI AT GmbH tyrol
10-17-2025 Cameron cmcknightmacneil@techinsights.com techinsights Canada
10-17-2025 woo sub lee lws@apact.co.kr APACT 대한민국
10-20-2025 Andrew Chen andrew.chen@lcygroup.com LCY Chemical Corp. Taiwan
10-20-2025 Lita Lshonroy@techcet.com TECHCET California
10-22-2025 Paul Nowakowski paul.nowakowski@lamresearch.com Lam Research Austria
10-26-2025 Cheah Xiang Ru xiangru.cheah@pactech.com PacTech Asia Malaysia
10-30-2025 Ken Tananka tanaka.kb@om.asahi-kasei.co.jp Asahi Kasei Microdevices Corp. 日本
10-31-2025 Dan Evans devans@bonders.com Palomar Technologies California
10-31-2025 Binh Pham binh.pham@viasat.com Viasat California
10-31-2025 Bart Berenbak bart.berenbak@besi.com Besi Netherlands