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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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| Press Release |
August 6, 2026 - Click the title to read the full press release.
The global RF industry is entering a new phase. For over a decade, smartphones drove its growth. Now, the market faces a short-term reset. Defense, automotive, and early 6G ...
Yole Group
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IC Device & Micro-Electronic Cleaning
Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge.
Kyzen Corporation
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