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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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| Press Release |
August 5, 2026 - Click the title to read the full press release.
The pace of innovation in the semiconductor industry is increasingly driven by the back end today. Chiplet architectures, 2.5D and 3D packaging, High Bandwidth Memory (HBM), ...
PBT Works
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IC Device & Micro-Electronic Cleaning
Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge.
Kyzen Corporation
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