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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
July 27, 2026 - Click the title to read the full press release.
The FAMES Pilot Line and SiNANO Institute will host a joint half-day workshop, "FD-SOI Pilot Line Insights and Perspective," on Sept. 7 at ESSERC 2026, the European Solid-State ...
FAMES
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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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