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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
July 24, 2026 - Click the title to read the full press release.
The advanced packaging market has entered a new cycle. The historical backend model is being replaced by a system-scaling model in which packaging determines AI-compute ...
YOLE Group
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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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