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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
July 22, 2026 - Click the title to read the full press release.
Veeco Instruments Inc. announced that Innolume, a leading vertically integrated developer and manufacturer of quantum dot (QD) lasers, has purchased a GEN2000™ Molecular ...
Veeco Instruments Inc.
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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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