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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
July 23, 2026 - Click the title to read the full press release.
EV Group announced that it has once again topped the rankings in the 2026 TechInsights Semiconductor Supplier Awards following results of TechInsights' 2026 Customer ...
EV Group
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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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