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TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
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| Press Release |
July 21, 2026 - Click the title to read the full press release.
Siemens announced a collaboration between Siemens Cre8Ventures and Cloudberry VC to help accelerate commercialization of Europe's sovereign deep-tech innovation ...
Siemens
July 22, 2026
Siemens to acquire Precision Innovations to expand AI-powered system-on-a-chip design
Siemens announced that it has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software company, expanding Siemens' ...
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July 21, 2026
Siemens and Cloudberry VC collaborate to accelerate European innovation
Siemens announced a collaboration between Siemens Cre8Ventures and Cloudberry VC to help accelerate commercialization of Europe's sovereign deep-tech innovation ...
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February 5, 2026
Siemens acquires Canopus AI to bring AI-based metrology to semiconductor manufacturing
Siemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve ...
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January 8, 2026
Siemens unveils technologies to accelerate the industrial AI revolution at CES 2026
At CES 2026, Siemens' keynote marked a new era of technology for industry and infrastructure, showcasing how customers and partners are harnessing artificial intelligence ...
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January 7, 2026
Siemens and NVIDIA Expand Partnership to Build the Industrial AI Operating System
Siemens and NVIDIA announced a significant expansion of their strategic partnership to bring artificial intelligence into the real world. Together, the companies aim to develop ...
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December 19, 2025
Toshiba to accelerate semiconductor design innovation with Siemens' EDA software
Siemens has introduced Siemens’ electronic design automation (EDA) software to enhance its power devices and analog semiconductor development capabilities. With this ...
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December 18, 2025
Toshiba to accelerate semiconductor design innovation with Siemens' EDA software
Siemens announced that Toshiba Electronic Devices & Storage Corporation has introduced Siemens' electronic design automation (EDA) software to enhance its power ...
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December 16, 2025
Siemens and GlobalFoundries collaborate to deploy AI-driven manufacturing
Siemens and GlobalFoundries (GF) have entered a new strategic collaboration to leverage each company’s complementary AI-based capabilities to enhance performance ...
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December 9, 2025
Certus Semiconductor adopts AI-powered Solido
Siemens announced that Certus Semiconductor has adopted Solido™ software for custom integrated circuit (IC) design to accelerate development of Input/output (IO) and ...
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November 18, 2025
SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology
Siemens announced that SAICEC has begun building complex digital twins of automotive architectures based on Siemens’ PAVE360™ software, facilitating comprehensive ...
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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