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Fine-Pitch MEMS Bonding Precision
Upgrade MEMS cantilever bonding with LAPLACE®-CAN. Laser-assisted accuracy, 30µm pitch, and inline repair for perfect wafer probe cards every time.
PacTech
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| Press Release |
July 16, 2026 - Click the title to read the full press release.
The continued evolution of electronics has increased the demand for advanced materials capable of delivering exceptional electrical performance, thermal stability, and long-term ...
M-Kube Enterprise LLC
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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