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Fine-Pitch MEMS Bonding Precision
Upgrade MEMS cantilever bonding with LAPLACE®-CAN. Laser-assisted accuracy, 30µm pitch, and inline repair for perfect wafer probe cards every time.
PacTech
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| Press Release |
July 15, 2026 - Click the title to read the full press release.
SCHMID Group has received a repeat order exceeding EUR 37 million from a leading Chinese customer for advanced HDI-ML and mSAP production equipment. The equipment ...
SCHMID Group
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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