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Sintering Bonding Process
During the sintering process, the chip is bonded very well to the substrate by means of silver paste. The silver particles are connected to one another by diffusion processes.
Tresky Automation
Uyemura
Press Release
June 25, 2026  -  Click the title to read the full press release.

SEMICON West 2026 to Spotlight Key Innovations and Market Drivers Powering the Semiconductor Industry Beyond $1 Trillion



SEMI announced this year's SEMICON® West will be held October 13-15 at Moscone Center in San Francisco. Returning to the Bay Area after a successful inaugural event ...

SEMI
July 14, 2026
SEMI and TechSearch International Release 2026 Edition of Worldwide Assembly & Test Facility Database
SEMI and TechSearch International announced the release of the 2026 edition of the Worldwide Assembly & Test Facility Database, a comprehensive resource tracking ...
July 10, 2026
SEMI Projects 300mm Memory Equipment Investment to Surpass $50 Billion in 2026
Worldwide 300mm fab equipment investment in the memory sector is projected to surpass $50 billion for the first time in 2026, rising 29% to $52 billion before increasing ...
June 25, 2026
SEMICON West 2026 to Spotlight Key Innovations and Market Drivers Powering the Semiconductor Industry Beyond $1 Trillion
SEMI announced this year's SEMICON® West will be held October 13-15 at Moscone Center in San Francisco. Returning to the Bay Area after a successful inaugural event ...
June 23, 2026
Strategic Materials Conference 2026 to Spotlight Materials Innovations Fueling the AI Era
The Strategic Materials Conference (SMC) 2026 will convene materials and semiconductor leaders from July 13-15, 2026 at Hayes Mansion in San Jose, Calif. for three days ...
June 16, 2026
SEMICON Taiwan 2026 to Serve as Global Stage Where the Semiconductor Industry Defines What's Next
SEMICON Taiwan 2026 will be held September 2-4 at the Nangang Exhibition Center in Taipei, with forums beginning on August 31 to align with International Semiconductor Week. ...
June 8, 2026
SEMI Reports Global Semiconductor Equipment Billings Increased 14% Year-Over-Year in Q1 2026
SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that global semiconductor equipment billings increased 14% year-over-year ...
May 28, 2026
SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends
SEMI announced the availability of a new industry research report focused on the glass core substrate market and trends, produced in collaboration with Global Net Corp. (GNC). ...
May 21, 2026
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
FlexTech issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ...
May 20, 2026
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
FlexTech issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ...
May 18, 2026
SEMI and 23 Member Companies Urge U.S. Congress to Extend Advanced Manufacturing Investment Credit
SEMI and 23 member companies on the SEMI Tax Policy Committee, issued a letter to the U.S. Congress urging immediate passage of a multi-year extension of the Advanced ...
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