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Sintering Bonding Process
During the sintering process, the chip is bonded very well to the substrate by means of silver paste. The silver particles are connected to one another by diffusion processes.
Tresky Automation
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| Press Release |
June 30, 2026 - Click the title to read the full press release.
Yole Group announces the release of its latest semiconductor equipment report, Mainland China Semiconductor Equipment Industry 2026, providing an in-depth analysis of one ...
Yole Group
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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