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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

June 24, 2026 - Click the title to read the full press release.

RF defense device market approaches US$3 billion by 2031

Yole Group announces the release of RF for Defense 2026, its first report dedicated entirely to radio-frequency technologies and devices used in defense applications. As defense ...

Yole Group

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH